A South African electronics manufacturer scanned a couple of objects as a proof of concept at our facility. Some of the resulting images are shown below, with some animations also. These show, amongst other things – the sphericity of balls in ball grid arrays (in a board with varios BGAs), the contact spaces between contact pads of an RF module, porosity bubbles inside the contact pads of the RF module as well as the lead solder contacts of a diode, as well as much more. For any further questions please send an email.
Animation of board with various BGAs: 3d rotate BGA board
3D animation of BGA: 3d rotate BGA zoom
Animation of RF module: 3d rotation rf module
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